Product Summary
The XCS10-3TQG144C is a high-volume production FPGA solution that delivers all the key requirements for ASIC replacement up to 40,000 gates. These requirements include high performance, on-chip RAM, core solutions and prices that, in high volume, approach and in many cases are equivalent to mask programmed ASIC devices.
Parametrics
XCS10-3TQG144C absolute maxing ratings: (1)VCC Supply voltage relative to GND: –0.5 to +7.0 V; (2)VIN Input voltage relative to GND: –0.5 to VCC +0.5 V; (3)VTS Voltage applied to 3-state output: –0.5 to VCC +0.5 V; (4)TSTG Storage temperature (ambient): –65 to +150 ℃; (5)TJ Junction temperature/Plastic packages: +125 ℃.
Features
XCS10-3TQG144C features: (1)First ASIC replacement FPGA for high-volume production with on-chip RAM; (2)Density up to 1862 logic cells or 40,000 system gates; (3)Streamlined feature set based on XC4000 architecture; (4)System performance beyond 80 MHz; (5)Broad set of AllianceCORE and LogiCORE predefined solutions available; (6)Unlimited reprogrammability; (7)Low cost.
Diagrams
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![]() XCS10-3PC84C |
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![]() IC FPGA 5V C-TEMP 84-PLCC |
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![]() XCS10-3TQ144C |
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![]() IC FPGA 5V C-TEMP 144-TQFP |
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![]() XCS10-3TQG144C |
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![]() XCS10-3VQ100C |
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![]() IC FPGA 5V C-TEMP 100-VQFP |
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![]() XCS10-3VQ100I |
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![]() IC FPGA 5V I-TEMP 100-VQFP |
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![]() Negotiable |
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